COMPARAISON - P.V.D. PROCESSES

E-Beam Sputtering Cathodic Arc
Substrate Temp. (Co)br
Degree Of Ionization (%)
Ion To Neutral Ratio
Mean Particle Energy (eV)
Deposition Rate (mm/min) 		400 - 550
10-50
1.0
<50
<0.5		 200-550
<10
0.1
10-40
<0.2		 400-500
50-80
2.4
50-150
<0.8

P.V.D. vs. Traditional Plating

  • Eliminates Costly Regulatory Compliance
  • Environmentally Safe
  • Non-Toxic

PVD presents a clear solution to many costly and time-consuming problems associated with traditional wet plating processes.